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1. general description the icode slix-s ic is a dedicated chip for smart label applications with the need for a higher security level, larger memory and/or a product which takes care of the increasing demand for perfect customer privacy. this ic is the third generation of a product family of smart label ics based on the iso standards iso/iec 15693 ( ref. 1 ) and iso/iec 18000-3 ( ref. 4 ), prolonging a successful story of nxp in t he field of vicinity identification systems. the icode system offers the possibility of oper ating labels simultaneously in the field of the reader antenna (antico llision). it is designed fo r long range applications. 1.1 contactless energy and data transfer whenever connected to a very simple and easy-to-produce type of antenna (as a result of the 13.56 mhz carrier frequency) made out of a few windings printed, winded, etched or punched coil, the icode slix-s ic can be operated without line of sight up to a distance of 1.5 m (gate width). no battery is needed. when the smart label is positioned in the field of an interrogator antenna, the high speed rf communication interface enables data to be transmitted up to 53 kbit/s. 1.2 anticollision an intelligent anticollision f unction enables several tags to operate in the field simultaneously. the anticollision algorithm select s each tag individua lly and ensures that the execution of a transaction with a select ed tag is performed correctly without data corruption result ing from other tags in the field. 1.3 security and privacy aspects ? unique identifier (uid): the uid cannot be altered and guarantees the uniqueness of each label. ? password protected memory management (read/write access): pages (1 page = 4 blocks of 4 bytes each) can be protected with a password, which ensures that only authorized users get read/write access to the protected parts of the user memory (anti counterfeiting). ? password protected label destroy: the 32-bit destroy password enables an addressed label to be destroyed with the destroy slix-s command. that status is irreversible and the label will never respond to any command again. ? password protected privacy mode: sl2s5302; sl2s5402 icode slix-s rev. 3.1 ? 1 october 2010 198531 product short data sheet public
sl2s5302_sl2s5402_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights rese rved. product short data sheet public rev. 3.1 ? 1 october 2010 198531 2 of 13 nxp semiconductors sl2s5302; sl2s5402 icode slix-s the 32-bit privacy password enables a label to be set to the privacy mode with the enable privacy command. in this mode the label will not respond to any command except the command get random number, until it next receives the correct privacy password. this mode is es pecially designed to meet the increasing demand to take care of the customers privacy. ? password protected eas and afi functionality: the 32-bit eas/afi password ena bles the addressed label to be set in a mode where the eas status, the eas id and/or the afi val ue can only be chan ged if the correct eas/afi password is transmitted to the label wit hin the mentioned commands. 2. features and benefits 2.1 icode slix-s rf in terface (iso/iec 15693) ? contactless transmission of data and supply energy (no battery needed) ? operating distance: up to 1.5 m (depending on antenna geometry) ? operating frequency: 13.56 mhz (ism, world-wide licence freely available) ? fast data transfer: up to 53 kbit/s ? high data integrity: 16-bit crc, framing ? true anticollision ? electronic article surveillance (eas) ? application family identifier (afi) supported ? data storage format identifier (dsfid) ? enable privacy command with 32-bit privacy password ? destroy slix-s command wit h 32-bit destroy password ? additional fast anticollision read ? write distance equal to read distance 2.2 eeprom ? 2048 bits (2 kb), organized in 64 blocks of 4 bytes each, 4 blocks are summed up to 1page ? 50 years data retention ? write endurance of 100000 cycles 2.3 security ? unique identifier for each device ? lock mechanism for each user memory block (write protection) ? lock mechanism for dsfid, afi, eas ? password (32-bit) protected memory management for read access ? password (32-bit) protected memory management for write access ? password (32-bit) protected label destroy ? password (32-bit) protected privacy mode ? password (32-bit) protecte d eas and afi functionality
sl2s5302_sl2s5402_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights rese rved. product short data sheet public rev. 3.1 ? 1 october 2010 198531 3 of 13 nxp semiconductors sl2s5302; sl2s5402 icode slix-s 3. applications ? libraries ? item level tagging in pharmaceutical supply chains ? counterfeit protection for consumer goods ? industrial applications ? asset and document tracking 4. quick reference data [1] bandwidth limitation ( 7 khz) according to ism band regulations. [2] measured with an hp4285a lcr meter at 13.56 mhz and 2 v rms. 5. ordering information table 1. quick reference data typical ratings are not guaranteed. the va lues listed are at room temperature. symbol parameter conditions min typ max unit wafer eeprom ch aracteristics t ret retention time t amb 55 c 50 --year n endu(w) write endurance 100000 - - cycle interface characteristics f i input frequency [1] 13.553 13.56 13.567 mhz c i input capacitance between la and lb [2] SL2S5302FUD 22.3 23.5 24.7 pf sl2s5402fud 92 97 102 pf table 2. ordering information type number package version name description SL2S5302FUD wafer sawn, bumped wafer, 120 m, on film frame carrier, c i between la and lb = 23.5 pf (typical) - sl2s5402fud wafer sawn, bumped wafer, 120 m, on film frame carrier, c i between la and lb = 97 pf (typical) -
sl2s5302_sl2s5402_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights rese rved. product short data sheet public rev. 3.1 ? 1 october 2010 198531 4 of 13 nxp semiconductors sl2s5302; sl2s5402 icode slix-s 6. block diagram fig 1. block diagram of icode slix-s 001aam24 7 mod demod vreg vdd clock data in data out r/w analog rf interface pa d pa d lb la rect cres digital control antenna anticollision read/write control access control eeprom interface control rf interface control eeprom memory sequencer charge pump clk
sl2s5302_sl2s5402_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights rese rved. product short data sheet public rev. 3.1 ? 1 october 2010 198531 5 of 13 nxp semiconductors sl2s5302; sl2s5402 icode slix-s 7. functional description 7.1 block description the icode slix-s ic consists of three major blocks: ? analog rf interface ? digital controller ? eeprom the analog section provides stable supply voltage and demodulates data received from the reader for processing by the digital sectio n. the analog section?s modulation transistor also transmits data back to the reader. the digital section includes the state mach ines, processes the protocol and handles communication with the eeprom. the label requires no internal power supply. its contactless interface generates the power supply and the system clock via the resonan t circuitry by inductive coupling to the interrogator. the interface also demodulates data that are transmitted from the interrogator to the icode label, and modul ates the electromagnetic field for data transmission from the icode label to the interrogator. data are stored in a non- volatile memory (eeprom). 7.2 memory organization the 2048 bit eeprom memory is divided into 64 blocks. a block is the smallest access unit. each block consists of 4 bytes (1 block = 32 bits). 4 blocks are summed up to 1 page for password protection. bit 0 in each byte represents the least significant bit (lsb) and bit 7 the most significant bit (msb), respectively. the memory is divided into 2 parts: ? configuration area ? within this part of the memo ry all required information is stored, such as uid, write protection, access control information, passwords, afi and eas. this memory area cannot be directly accessed. ? user memory ? within the 1280 bit memory area the user data are stored. direct read/write access to this part of the memory is possible depending on the related security and write protection conditions.
sl2s5302_sl2s5402_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights rese rved. product short data sheet public rev. 3.1 ? 1 october 2010 198531 6 of 13 nxp semiconductors sl2s5302; sl2s5402 icode slix-s blocks 0 to 39 can be addressed wit h read and write commands only. 7.2.1 unique identifier the 64-bit unique identifier (uid) is programmed during the production process according to iso/iec 15693-3 and cannot be changed afterwards. the 64 bits are numbered according to iso/iec 15693-3 starting with lsb 1 and ending with msb 64. this is in contrast to t he general used bit numbering within a byte. the tag type is a part of the uid (bit 41 to 48, next to the manufacturer code which is ?04h? for nxp semiconductors). the tag type of the icode slix-s ic is ?02h?. bit 37 is set to logic 1 for the icode slix-s ic which indicates that this type supports the password protected afi feature (not supported by icode sli-s with bit 37 set to logic 0). table 3. memory organization page block byte 0 byte 1 byte 2 byte 3 description configuration area for internal use 0 0 user memory: 10 pages, 4 blocks each, 4 bytes each, 160 bytes in total. 1 2 3 :::::: 936 37 38 39 table 4. unique identifier msb lsb 64:57 56:49 48:41 40:1 ?e0? ?04? ?02? ic manufacturer serial number uid 7 uid 6 uid 5 uid 4 uid 3 uid 2 uid 1 uid 0
sl2s5302_sl2s5402_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights rese rved. product short data sheet public rev. 3.1 ? 1 october 2010 198531 7 of 13 nxp semiconductors sl2s5302; sl2s5402 icode slix-s 8. limiting values [1] stresses above those listed under absolute maximum ratings ma y cause permanent damage to the device. this is a stress rating only and functional operation of the device at th ese or any conditions other than those des cribed in the operating conditions and el ectrical characteristics sections of this specification is not implied. [2] this product includes circ uitry specifically designed for the protection of its internal devices from the damaging effects o f excessive static charge. nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima. [3] the voltage between la and lb is limited by the on-chip voltage limitation circuitry (corresponding to parameter i i ). [4] for esd measurement, the ic was mounted in a cdip8 package. table 5. limiting values (wafer) [1] [2] in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit t stg storage temperature ? 55 +125 c p tot total power dissipation - 125 mw t j junction temperature ? 40 +85 c i i(max) maximum input current la to lb; peak [3] - 60 ma i i input current la to lb; rms - 30 ma v esd electrostatic discharge voltage human body model [4] - 2kv
sl2s5302_sl2s5402_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights rese rved. product short data sheet public rev. 3.1 ? 1 october 2010 198531 8 of 13 nxp semiconductors sl2s5302; sl2s5402 icode slix-s 9. abbreviations 10. references [1] iso standard ? iso/iec 15693 - identification cards - contactless integrated circuit cards - vicinity cards. [2] iso standard ? iso/iec 15693-2 -identification cards - contactless integrated circuit cards - vicinity cards - part 2: air interface and initialization. [3] iso standard ? iso/iec 15693-3 -identification cards - contactless integrated circuit cards - vicinity cards - part 3: anticollision and tran smission protocol. [4] iso standard ? iso/iec 18000-3 - information technology - radio frequency identification for item management - part 3: parameters for air interface communications at 13.56 mhz. [5] iso standard ? iso/iec 7816-6 - identification cards - integrated circuit cards - part 6: interindustry data elements for interchange. [6] general specification for 8? wafe r on uv-tape with electronic fail die marking ? delivery type description ? bu-id document number: 1093** 1 . [7] sl2s5302; sl2s5402 ? product data sheet ? bu-id document number: 1921** table 6. abbreviations acronym description afi application family identifier crc cyclic redundancy check dsfid data storage format identifier eas electronic article surveillance eeprom electrically erasable pr ogrammable re ad only memory ic integrated circuit lcr inductance, capacitance, resistance lsb least significant byte/bit msb most significant byte/bit rf radio frequency uid unique identifier 1. ** ... document version number
sl2s5302_sl2s5402_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights rese rved. product short data sheet public rev. 3.1 ? 1 october 2010 198531 9 of 13 nxp semiconductors sl2s5302; sl2s5402 icode slix-s 11. revision history table 7. revision history document id release date data sheet status change notice supersedes sl2s5302_sl2s5402_sds v.3.1 20101001 product short data sheet - -
sl2s5302_sl2s5402_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights rese rved. product short data sheet public rev. 3.1 ? 1 october 2010 198531 10 of 13 nxp semiconductors sl2s5302; sl2s5402 icode slix-s 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 12.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 12.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
sl2s5302_sl2s5402_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights rese rved. product short data sheet public rev. 3.1 ? 1 october 2010 198531 11 of 13 nxp semiconductors sl2s5302; sl2s5402 icode slix-s quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 12.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. icode and i-code ? are trademarks of nxp b.v. 13. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
sl2s5302_sl2s5402_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights rese rved. product short data sheet public rev. 3.1 ? 1 october 2010 198531 12 of 13 nxp semiconductors sl2s5302; sl2s5402 icode slix-s 14. tables table 1. quick reference data . . . . . . . . . . . . . . . . . . . . .3 table 2. ordering information . . . . . . . . . . . . . . . . . . . . .3 table 3. memory organization . . . . . . . . . . . . . . . . . . . . .6 table 4. unique identifier . . . . . . . . . . . . . . . . . . . . . . . . .6 table 5. limiting values (wafer) [1][2] . . . . . . . . . . . . . . . . 7 table 6. abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 7. revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 15. figures fig 1. block diagram of icode sl ix-s . . . . . . . . . . . . . .4
nxp semiconductors sl2s5302; sl2s5402 icode slix-s ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 1 october 2010 198531 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 16. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 1.1 contactless energy and data transfer. . . . . . . . 1 1.2 anticollision. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 security and privacy aspects . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 2 2.1 icode slix-s rf interface (iso/iec 15693) . 2 2.2 eeprom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.3 security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 3 5 ordering information . . . . . . . . . . . . . . . . . . . . . 3 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 functional description . . . . . . . . . . . . . . . . . . . 5 7.1 block description . . . . . . . . . . . . . . . . . . . . . . . 5 7.2 memory organization . . . . . . . . . . . . . . . . . . . . 5 7.2.1 unique identifier . . . . . . . . . . . . . . . . . . . . . . . . 6 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 references . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 legal information. . . . . . . . . . . . . . . . . . . . . . . 10 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 12.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13 contact information. . . . . . . . . . . . . . . . . . . . . 11 14 tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 15 figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 16 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

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